From: Micro-drilling of silicon wafer by industrial CO2 laser
Specification | Description |
---|---|
Model | Helius 2513 laser cutting machine |
Controller | FANUC Series 160 i-L |
Maximum capacity | 3 kW |
Laser beam wavelength | 10.6 μm |
Laser source | CO2 gas with the real ingredient mixture of N2 (55%), He (40%), CO2 (5%) with purity of 99.995% |
Lense size | 5 to 7.5 in. |
Compressed air | 5 to 6 bar |