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Table 1 Complete specification of the Helius CO 2 laser machine

From: Micro-drilling of silicon wafer by industrial CO2 laser

Specification

Description

Model

Helius 2513 laser cutting machine

Controller

FANUC Series 160 i-L

Maximum capacity

3 kW

Laser beam wavelength

10.6 μm

Laser source

CO2 gas with the real ingredient mixture of N2 (55%), He (40%), CO2 (5%) with purity of 99.995%

Lense size

5 to 7.5 in.

Compressed air

5 to 6 bar